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Resin, Polyimide, Laminating High Temperature Resistant, 315°C (599°F)
- Aerospace Material Specification
Published October 01, 1979 by SAE International in United States
This specification covers a single-component, heat-reactive, thermosetting aromatic system which thermally cures to form a polyimide polymer structure. This product has been used typically as a resin matrix for fiber-reinforced- composite parts requiring good strength after long-term exposure up to 315 degrees C (599 degrees F) and after short-term exposure up to 370 degrees C (698 degrees F), but usage is not limited to such applications.
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