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New Tensile Strength Measurement Method for Individual Flip Chip Bump
Published May 21, 1997 by Society of Automotive Engineers of Japan in Japan
Event: JSAE Spring Conference
Bump bonding is a technique for making the interconnection between Flip Chip devices and their substrates. The conventional measurement method of bump strength determines the total strength of array of bonded bumps by pulling the Flip Chip away from the substrate. However, this method has several limitations. These limitations were overcome by the development of a tensile test machine capable of measuring singular bump. It was found that this developed test method was possible to measure accurately the tensile strength of individual fracture mode comparing with the conventional test method.