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High Temperature Creep Behavior of Ceramic and Metal Substrates
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English
Abstract
The high temperature creep data for radial specimens, cut from metal and ceramic substrates and subjected to compressive loads representative of mounting and thermal pressure are presented as function of load and temperature. These data show that the creep resistance of metallic specimens under sustained loading varies with temperature and is orders of magnitude lower than that of ceramic specimens. The observed creep deformation in metallic specimens reduces their open frontal area and hydraulic diameter with potentially adverse impact on pressure drop across the metallic substrate.
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Citation
Gulati, S., Geisinger, K., Reddy, K., and Thompson, D., "High Temperature Creep Behavior of Ceramic and Metal Substrates," SAE Technical Paper 910374, 1991, https://doi.org/10.4271/910374.Also In
References
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