Surface Quality Optimization of Adhesive Bonded SMC Assemblies Through Designed Experimentation and Photographic Analysis

This paper will discuss an approach to surface quality optimization for adhesive bonded SMC assemblies. The use of designed experimentation methodology based on orthogonal arrays will be described as applied to assembly process parameters. Evaluation of results with a photographic process will be used to generate data for analysis. The analysis of this data will conclude this approach to surface quality optimization.