This content is not included in
your SAE MOBILUS subscription, or you are not logged in.
Surface Quality Optimization of Adhesive Bonded SMC Assemblies Through Designed Experimentation and Photographic Analysis
Annotation ability available
Sector:
Language:
English
Abstract
This paper will discuss an approach to surface quality optimization for adhesive bonded SMC assemblies. The use of designed experimentation methodology based on orthogonal arrays will be described as applied to assembly process parameters. Evaluation of results with a photographic process will be used to generate data for analysis. The analysis of this data will conclude this approach to surface quality optimization.
Authors
Citation
Martin, D., "Surface Quality Optimization of Adhesive Bonded SMC Assemblies Through Designed Experimentation and Photographic Analysis," SAE Technical Paper 880533, 1988, https://doi.org/10.4271/880533.Also In
References
- Davis Duane Cosenza Robert M. Business Research for Decision Making 123 127
- Wu Yuin “Quality Engineering Using Taguchi Methods” American Supplier Institute, Incorporated 1984
- “D-Sight” EVA-1000 User's Manual” Diffracto Limited
- Dixon Wilfrid J. Massey Frank J. Jr., Introduction to Statistical Analysis 1969