Worldwide Status of Leadless Component Assembly Technology
820916
02/01/1982
- Event
- Content
- The wide variety of available leadless electronic components is described. Some typical applications of these devices are illustrated. The advantages to be gained through the use of these surface mounted devices are explained. These include reduced size, increased reliability, improved performance and reduced cost. Methods of application, including automatic assembly equipment, are discussed. Several applicable soldering processes are explained.
- Pages
- 8
- Citation
- Moe, R., and Colten, R., "Worldwide Status of Leadless Component Assembly Technology," SAE Technical Paper 820916, 1982, https://doi.org/10.4271/820916.