Sputtering and Ion Plating as Industrial Processes
Published February 1, 1973 by SAE International in United States
Annotation of this paper is available
Ion plating and sputtering offer materials engineers versatile coating methods. Both processes use a controlled pressure chamber and vacuum equipment. Sputtering is essentially a line of sight deposition method. The coating material is partially ionized, following electrical lines of force, during ion plating, uniformly coating the substrate configuration. Both processes-their applications and advantages-are discussed. Although the processes are not economically competitive with electroplating or other conventional coating methods, the properties they provide may offset the costs.