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A Thin Film Metallization System for Various Assembly Techniques
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English
Abstract
This paper describes a thin film metallization system using nichrome-nickel-gold on alumina substrates. The system meets the specifications of several company hybrid microelectronic facilities. The capabilities and overall reliability of the deposition system are discussed in relation to the various assembly techniques used by these facilities to produce high reliable circuits.
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Citation
Waufle, H., "A Thin Film Metallization System for Various Assembly Techniques," SAE Technical Paper 710802, 1971, https://doi.org/10.4271/710802.Also In
References
- Loasby R. G. “Material Problems in Microelectronic Circuits.” Jrl. of the British Interplanetary Society 22 369 375 1969
- Tomlin J. E. “The Metallurgy of Soldering Microconnections.” Electronic Engineering October 1969
- Novick David T. Kroehs Alfred R. “Noble Metal Scavenging in Hybrid Circuit Bonding Applications.” ISHM Symposium November 1970
- Drumheller C. Megadyne Corp. Private Correspondence