A Thin Film Metallization System for Various Assembly Techniques

710802

02/01/1971

Event
National Aeronautical and Space Engineering and Manufacturing Meeting
Authors Abstract
Content
This paper describes a thin film metallization system using nichrome-nickel-gold on alumina substrates. The system meets the specifications of several company hybrid microelectronic facilities. The capabilities and overall reliability of the deposition system are discussed in relation to the various assembly techniques used by these facilities to produce high reliable circuits.
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DOI
https://doi.org/10.4271/710802
Pages
6
Citation
Waufle, H., "A Thin Film Metallization System for Various Assembly Techniques," SAE Technical Paper 710802, 1971, https://doi.org/10.4271/710802.
Additional Details
Publisher
Published
Feb 1, 1971
Product Code
710802
Content Type
Technical Paper
Language
English