A Thin Film Metallization System for Various Assembly Techniques
710802
02/01/1971
- Event
- Content
- This paper describes a thin film metallization system using nichrome-nickel-gold on alumina substrates. The system meets the specifications of several company hybrid microelectronic facilities. The capabilities and overall reliability of the deposition system are discussed in relation to the various assembly techniques used by these facilities to produce high reliable circuits.
- Pages
- 6
- Citation
- Waufle, H., "A Thin Film Metallization System for Various Assembly Techniques," SAE Technical Paper 710802, 1971, https://doi.org/10.4271/710802.