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A Thin Film Metallization System for Various Assembly Techniques
ISSN: 0148-7191, e-ISSN: 2688-3627
Published February 01, 1971 by SAE International in United States
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This paper describes a thin film metallization system using nichrome-nickel-gold on alumina substrates. The system meets the specifications of several company hybrid microelectronic facilities. The capabilities and overall reliability of the deposition system are discussed in relation to the various assembly techniques used by these facilities to produce high reliable circuits.
CitationWaufle, H., "A Thin Film Metallization System for Various Assembly Techniques," SAE Technical Paper 710802, 1971, https://doi.org/10.4271/710802.
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