This content is not included in your SAE MOBILUS subscription, or you are not logged in.
Recent Developments in Applications of Electroless Nickel Plating
ISSN: 0148-7191, e-ISSN: 2688-3627
Published February 01, 1969 by SAE International in United States
Annotation ability available
Recent developments in the field of electroless nickel plating are outlined. Metal ion reduction by boron-containing reductants is a significant advance and gives deposits which are phosphorus-free, metal-boron alloys. Properties of these deposits such as composition, structure, density, hardness, etc. are reviewed.
Two types of reducing agents can be employed in aqueous electroless nickel systems. This paper stresses the preference for dimethylamine borane (DMAB) in the plating bath. The special properties of nickel-boron alloys and the versatility of DMAB plating baths suggest a number of applications such as plating of electronic components, high temperature applications, and applications where uniformity and thickness of deposits is a basic requirement. The primary limitation of DMAB is the high cost of the chemical which might make certain applications not economically practical.
CitationMallory, G., "Recent Developments in Applications of Electroless Nickel Plating," SAE Technical Paper 690646, 1969, https://doi.org/10.4271/690646.
- Berzins U.S. Patent 3,045,334 E.I. duPont de Nemours
- McLeod S. Patent 3,062,666 E.I. duPont de Nemours
- Berzins U.S. Patent 3,338,726 E.I. duPont de Nemours
- Zirngiebl U.S. Patent 3,140,188 Farbenfabriken Bayer
- Zirngiebl U.S. Patent 3,234,031 Farbenfabriken Bayer
- Berzins Canada Patent 626,999 E.I. duPont de Nemours
- Berzins Canada Patent 715,451 E.I. duPont de Nemours
- Berzins British Patent 842,826 E.I. duPont de Nemours
- Copper et al. “Electroless Plating with Amine Boranes.” Technical Bulletin CCC-AB-1 Callery Chemical Co. Feb. 19 1959
- Corbanova Nikoforova “Physicochemical Principles of Nickel Plating.” Academy of Sciences of the U.S.S.R. Published for the National Science Foundation Washington D. C. and Dept. of Commerce 1963
- Brenner et al. “Symposium on Electroless Nickel Plating.” ASTM Special Technical Publication No. 265 1959