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DISCRETE ASSEMBLIES VS. THICK FILM IC’s
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English
Abstract
Thick Film is an old technology that is finding new applications. Many of the future integrated circuits for the automotive industry will employ Thick Film Technology. It offers an easy transition from discrete component assemblies, while providing lower overall costs and improved reliability.
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Authors
Citation
HOFFMAN, E., "DISCRETE ASSEMBLIES VS. THICK FILM IC’s," SAE Technical Paper 690013, 1969, https://doi.org/10.4271/690013.Also In
References
- Thick films headed for wide usage in the 1970’s Gechman Ronald West Coast Electronic Design 16 August 1 1968
- Thick Film Technology Conference Microelectronics May 1968
- How to Design Thick Film Hybrid ICs Hays William Hise John Van National Semiconductor Corporation Electronic Engineer August 1967
- ICs Strive for Auto Maturity Mirrors of Motordom Steel April 1 1968
- Autos Hold Golden Lure to ICs Focus on Procurement, Electronic Procurement August 1968
- Screen Printed Hybrid Integrated Circuitry Du Pont E. I. October 1965