Simplified Automation of Microelectronic Module Interconnections

The paper describes a method of interconnecting integrated circuits, hybrid circuits, small encapsulated circuit modules, and certain types of discrete components. It uses simple semi-automatic or completely automated processes which do not require large investment in capital and elaborate equipment. The transition from the circuit designer's interconnection diagram or wiring list to the fabricated interconnection matrix can be effected within minutes or hours instead of days or weeks. The method offers the compactness and complex interconnection capabilities of multi-layer circuit boards, but without long lead times and high cost.