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Postage Stamp Electronics
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English
Abstract
THIS PAPER DISCUSSES the various forms of hybrid circuits being fabricated at this time, and the processes and techniques used to fabricate these devices.
The reader will find that there is little new or startling in the processes and techniques being used. It will be found, however, that the manner in which these processes and techniques are used is new and novel, also, the manner in which some microminiature components are being used may be considered unique.
The packaging design, processes and techniques to be discussed in this paper develop into an electronics package and/or system which may be considered the step between the integrated circuit device and the much discussed, but not yet realized, large scale integrated circuit.
Authors
Citation
Shankin, M., "Postage Stamp Electronics," SAE Technical Paper 680794, 1968, https://doi.org/10.4271/680794.Also In
References
- Parks, M. S. “The Story of Microelectronics…First, Second, and Future Generations,” Anaheim, California: North American Aviation, Autonetics Division, 1966.
- Dummer, G. W. A. “A Review of British Work on Microminiaturization Techniques,” Page 3 of Proceedings of AGARD Conference, Oslo, Norway, July22–26,1961.
- Staff Report, “Multifunction Airborne Radar, Page 75, Space and Aeronautics, February1967.
- Staff Report,“Substrates for Microelectronics Packaging,” Page 86, Electronics Packaging and Production, March1966.
- See Reference (1)
- See Reference (4)
- “Mechanical and Electrical Properties of AlSiMag Ceramics,” Chart No. 671, American Lava Corporation; Chattanooga, Tennessee.
- Schlaback T. and Rider, D. K. “Printed and Integrated Circuitry Materials and Processes,” New York, New York: McGraw-Hill Book Co., Inc..1963.
- Stetson, H. W. “Ceramic and Glass Insulation in Data Processing Equipment,” Paper presented at Electrical Insulation Conference, New York, New York,1965.
- “Microelectronics Engineering” TP-202, U.S. Naval Avionics Facility, Indianapolis, Indiana.
- Material Requirements for Thick Film Hybrid Circuits, Boeing Document.
- Pawluic, Hal Passive Components for Hybrids, Page 67, The Electronic Engineer, October1967.
- Mallery, P. “Bonding Beam-Lead Silicon Integrated Circuits,” Paper presented NEPCON West, February1968.
- Coucoulas A. and Cranston, B. H.“Compliant Bonding – A New Technique for Joining Microelectronic Components,” Paper presented at International Electron Devices Group, Washington, D.C., October1967.
- Hansen, “Constitution of Binary Alloys,” New York, New York, McGraw-Hill Book Co. Inc.
- Socolousky, A. Wenigner K. and Edelman, S. “ISSCC - Consumer Products Got a Piece of the Action,” Page 72, Electronic Engineering, April1968.