THIS PAPER DISCUSSES the various forms of hybrid circuits being fabricated at this time, and the processes and techniques used to fabricate these devices.
The reader will find that there is little new or startling in the processes and techniques being used. It will be found, however, that the manner in which these processes and techniques are used is new and novel, also, the manner in which some microminiature components are being used may be considered unique.
The packaging design, processes and techniques to be discussed in this paper develop into an electronics package and/or system which may be considered the step between the integrated circuit device and the much discussed, but not yet realized, large scale integrated circuit.