A Novel Approach to Microcircuit Interconnection and Packaging

As electronic components and circuits get smaller the problems of mounting and interconnecting elements into a system become more difficult. This paper indicates how one packaging concept using a carrier-mother board, rack approach, interconnected by wire-wrap techniques solves some of the problems imposed by these small components. Flexibility, cost, reliability and their influence on the selection of the final configuration are investigated. The application of hot gas soldering for mounting flat packs to carriers is described along with the advantages gained by its use.