New 300-mm wafer fab is key to Bosch's chip future
- Magazine Article
- 22AUTP10_06
- English
A new semiconductor plant is the single largest investment made by
Bosch claims that the new Dresden plant, which began construction in 2017, is the first 300-mm (11.8-in.) wafer production plant (known as a wafer fab) to be built in Europe since 1999. Its construction was in step with the European Chips Act announced in February 2022. One of the aims of the Act is to double Europe's share of global semiconductor production from 10% to 20% by 2030.