This content is not included in your SAE MOBILUS subscription, or you are not logged in.
Thermal Modeling of DC/AC Inverter for Electrified Powertrain Systems
ISSN: 0148-7191, e-ISSN: 2688-3627
Published April 14, 2020 by SAE International in United States
This content contains downloadable datasetsAnnotation ability available
A DC-to-AC main Power Inverter Module (PIM) is one of the key components in electrified powertrain systems. Accurate thermal modeling and temperature prediction of a PIM is critical to the design, analysis, and control of a cooling system within an electrified vehicle. PIM heat generation is a function of the electric loading applied to the chips and the limited heat dissipation within what is typically compact packaging of the Insulated Gate Bipolar Transistor (IGBT) module inside the PIM. This work presents a thermal modeling approach for a 3-phase DC/AC PIM that is part of an automotive electrified powertrain system. Heat generation of the IGBT/diode pairs under electric load is modeled by a set of formulae capturing both the static and dynamic losses of the chips in the IGBT module. A thermal model of the IGBT module with a simplified liquid cooling system generates temperature estimates for the PIM. Temperatures of chips, baseplates, and sinks are predicted from electric input loads. A case study is provided in which the PIM thermal model is coupled with an electric motor model to demonstrate transient temperature predictions of PIM electric components during a hybrid electric vehicle drive cycle.
CitationLi, M., Geist, B., and He, F., "Thermal Modeling of DC/AC Inverter for Electrified Powertrain Systems," SAE Technical Paper 2020-01-1384, 2020, https://doi.org/10.4271/2020-01-1384.
Data Sets - Support Documents
|[Unnamed Dataset 1]|
- He, F., Li, X., and Lin, M. , “Combined Experimental and Numerical Study of Thermal Management of Battery Module Consisting of Multiple Li-Ion Cells,” International Journal of Heat and Mass Transfer 72:622-629, 5/2014.
- He, F. and Lin, M. , “Thermal Management of Batteries Employing Active Temperature Control and Reciprocating Cooling Flow,” International Journal of Heat and Mass Transfer 83:164-172, Apr. 2015.
- He, F., Ewing, D., Finn, J., Wagner, J., and Lin, M. , “Thermal Management of Vehicular Payloads Using Nanofluid Augmented Coolant Rail - Modeling and Analysis,” SAE Int. J. Alt. Power. 2(1):194-203, 2013, doi:https://doi.org/10.4271/2013-01-1641.
- Mapelli, F.L., Tarsitano, D., and Mauri, M. , “Plug-in Hybrid Electric Vehicle: Modeling, Prototype Realization, and Inverter Losses Reduction Analysis,” IEEE Transactions on Industrial Electronics 57(2):598-607, 2010.
- Berringer, K., Marvin, J., and Perruchoud, P. , “Semiconductor Power Losses in Ac Inverters,” Paper presented at the in Industry Applications Conference, 1995. Thirtieth IAS Annual Meeting, IAS '95., Conference Record of the 1995 IEEE, Oct 8-12, 1995.
- Pou, J., Osorno, D., Zaragoza, J., Jaen, C., and Ceballos, S. , “Power Losses Calculation Methodology to Evaluate Inverter Efficiency in Electrical Vehicles,” Paper presented at the in 2011 7th International Conference-Workshop Compatibility and Power Electronics (CPE), June 1-3, 2011.
- Bouzida, A., Abdelli, R., and Ouadah, M. , “Calculation of Igbt Power Losses and Junction Temperature in Inverter Drive,” Paper presented at the in 2016 8th International Conference on Modelling, Identification and Control (ICMIC), Nov. 15-17, 2016.
- Zhou, Z., Khanniche, M.S., Igic, P., Kong, S.T. et al. , “A Fast Power Loss Calculation Method for Long Real Time Thermal Simulation of Igbt Modules for a Three-Phase Inverter System,” International Journal of Numerical Modelling: Electronic Networks, Devices and Fields 19(1):33-46, 2006.
- Dewei, X., Haiwei, L., Lipei, H., Azuma, S. et al. , “Power Loss and Junction Temperature Analysis of Power Semiconductor Devices,” IEEE Transactions on Industry Applications 38(5):1426-1431, 2002.
- Kojima, Y., Ciappa, M., Chiavarini, M., and Fichtner, W. , “A Novel Electro-Thermal Simulation Approach of Power Igbt Modules for Automotive Traction Applications,” Paper presented at the in 2004 Proceedings of the 16th International Symposium on Power Semiconductor Devices and ICs, May 24-27, 2004.
- Rajapakse, A.D., Gole, A.M., and Wilson, P.L. , “Approximate Loss Formulae for Estimation of Igbt Switching Losses through Emtp-Type Simulations,” 2017.
- Rajapakse, A.D., Gole, A.M., and Wilson, P.L. , “Electromagnetic Transients Simulation Models for Accurate Representation of Switching Losses and Thermal Performance in Power Electronic Systems,” IEEE Transactions on Power Delivery 20(1):319-327, 2005.
- Ward, D., Husain, I., Cstro, C., Volke, A., and Hornkamp, M. , Fundamentals of Semiconductors for Hybrid-Electric Powertrain (Lavonia: Infineon Technologies North America Corp, 2013).
- Kojima, T., Yamada, Y., Nishibe, Y., and Torii, K. , “Novel Rc Compact Thermal Model of Hv Inverter Module for Electro-Thermal Coupling Simulation,” Paper presented at in the 2007 Power Conversion Conference - Nagoya, April 2-5, 2007.
- Gnielinski, V. , “Neue Gleichungen Für Den Wärme- Und Den Stoffübergang in Turbulent Durchströmten Rohren Und Kanälen,” Forschung im Ingenieurwesen A 41(1):8-16, January 01 1975.
- Incropera, F.P. and Dewitt, D.P. , Fundamentals of Heat and Mass Transfer 6th Edition (Wiley, 2007).
- Oberdorf, M. , Power Losses and Thermal Modeling of a Voltage Source Inverter (Naval Postgraduate School Monterey CA, 2006).
- Miller, S. , “Hybrid-Electric Vehicle Model in Simulink,” MATLAB Central File Exchange, https://www.mathworks.com/matlabcentral/fileexchange/28441.
- Schütze, T. AN2008-03: Thermal Equivalent Circuit Models. Application Note. V1.0 (Germany: Infineon Technologies AG, 2008).