Power Electronic Noise - Simulation Measurement Comparison
To be published on June 5, 2019 by SAE International in United States
A growing development of hybrid or fully electrical drives increase demand for accurate prediction of noise and vibration characteristic of electric and electronic components. This paper describes the numerical and experimental investigation of noise emission from power electronics, as a one of the new important noise sources in electric vehicles. Emitted noise from the printed circuit board (PCB) equipped with multi-layer ceramic capacitors (MLCC) is measured and used for calibration and validation of numerical model. Material properties are tuned using results from experimental modal analysis with special attention on orthotropic characteristic of PCB glass-reinforced epoxy laminate sheet (FR-4). Structural vibrations are calculated with commercial FEM solver with modal frequency response analysis. Sound radiation is simulated using the wave based approach. Simulation and experimental results are compared in frequency range up to 10 kHz. Developed simulation methodology can successfully identify the main noise sources from equipped PCB. Critical peak noise responses are identified both in experiment and simulation.