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Improvement of Adhesion Properties between Epoxy Resin and Primer and between Primer and Ni Plating in Hybrid Vehicle Power Semiconductor Module under High Temperature Conditions
Technical Paper
2016-01-0500
ISSN: 0148-7191, e-ISSN: 2688-3627
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English
Abstract
In this report, adhesion mechanism between epoxy resin and primer and between primer and Ni platting in Hybrid vehicle (HV) was investigated. Adhesion forces are thought to be a combination of mechanical bond forces (such as anchor effect), chemical bond forces and physical bond forces (such as hydrogen bonding and Van der Waals force). Currently there is insufficient understanding of the adhesion mechanism. In particular, the extent to which the three bond forces contribute to adhesion strength. So the adhesion mechanism of polyimide primers was analyzed using a number of different methods, including transmission electron microscope (TEM) and atomic force microscope (AFM) observation, to determine the contributions of the three bonding forces. Molecular simulation was also used to investigate the relationship between adhesion strength and the molecular structure of the primer.
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Kato, A., Takano, M., Hase, K., Inuzuka, S. et al., "Improvement of Adhesion Properties between Epoxy Resin and Primer and between Primer and Ni Plating in Hybrid Vehicle Power Semiconductor Module under High Temperature Conditions," SAE Technical Paper 2016-01-0500, 2016, https://doi.org/10.4271/2016-01-0500.Also In
References
- Koshibe S. Function & Materials 35 1 2015 11 18
- Nakanishi M. Function & Materials 35 1 2015 32 40
- Hirano N. et al Denso Technical Review 16 2011 30 37
- Takahashi Y. et al Fuji Electric Journal 85 2012 6 392 397
- Nashida N. et al Fuji Electric Journal 85 2012 6 403 407
- Ohashi H. J.IEE Japan 122 2002 3 168 171
- Tsuruta K. Denso Technical Review 16 2011 90 95
- Material Science Society of Japan, Adhesion and Materials 3 SHOKABO 1996
- Tanaka M. , Komagata M. , Tsukada M. , Kamiya H. Powder Technology 183 2008 273 281
- Minamizaki Y. et al. Journal of the Japan Welding Society 83 2014 8
- Semoto T. et al J. Phys. Chem. C 2011 115 11701 11708
- Semoto T. et al. Bull. Chem. Soc. Jpn. 85 6 672 878 2012