Improvement of Adhesion Properties between Epoxy Resin and Primer and between Primer and Ni Plating in Hybrid Vehicle Power Semiconductor Module under High Temperature Conditions

2016-01-0500

04/05/2016

Event
SAE 2016 World Congress and Exhibition
Authors Abstract
Content
In this report, adhesion mechanism between epoxy resin and primer and between primer and Ni platting in Hybrid vehicle (HV) was investigated. Adhesion forces are thought to be a combination of mechanical bond forces (such as anchor effect), chemical bond forces and physical bond forces (such as hydrogen bonding and Van der Waals force). Currently there is insufficient understanding of the adhesion mechanism. In particular, the extent to which the three bond forces contribute to adhesion strength. So the adhesion mechanism of polyimide primers was analyzed using a number of different methods, including transmission electron microscope (TEM) and atomic force microscope (AFM) observation, to determine the contributions of the three bonding forces. Molecular simulation was also used to investigate the relationship between adhesion strength and the molecular structure of the primer.
Meta TagsDetails
DOI
https://doi.org/10.4271/2016-01-0500
Pages
6
Citation
Kato, A., Takano, M., Hase, K., Inuzuka, S. et al., "Improvement of Adhesion Properties between Epoxy Resin and Primer and between Primer and Ni Plating in Hybrid Vehicle Power Semiconductor Module under High Temperature Conditions," SAE Technical Paper 2016-01-0500, 2016, https://doi.org/10.4271/2016-01-0500.
Additional Details
Publisher
Published
Apr 5, 2016
Product Code
2016-01-0500
Content Type
Technical Paper
Language
English