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Thermal Electric Analysis of Bond Wires Used in Automotive Electronic Modules
ISSN: 0148-7191, e-ISSN: 2688-3627
Published April 14, 2015 by SAE International in United States
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Bond wires are used in automotive electronic modules to carry current from external harness to components where flexibility under thermal cyclic loading is very essential between PCB (Printed Circuit Board) and connectors. They are very thin wires (few μm) made up of gold, aluminum or copper and have to undergo mechanical reliability to withstand extreme mechanical and thermal loads during different vehicle operation scenarios. Thermal reliability of bond wire is to make sure that it can withstand prescribed electric current under given boundary conditions without fusing thereby retaining electronic module's functionality. While carrying current, bond wire by virtue of its nature resists electric current flow and generates heat also called as joule heating. Joule heating is proportional to current flow and electrical resistance and if not handled properly can lead to thermal run away conditions.
CitationWani, S., "Thermal Electric Analysis of Bond Wires Used in Automotive Electronic Modules," SAE Technical Paper 2015-01-0195, 2015, https://doi.org/10.4271/2015-01-0195.
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