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Correlation Study on Parameters Affecting Springback Phenomenon in Stamping Simulation
ISSN: 0148-7191, e-ISSN: 2688-3627
Published April 08, 2013 by SAE International in United States
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Springback is a major phenomenon in sheet metal forming process that has to be tackled to achieve the desired product with greater dimensional accuracy. Springback occurs due to elastic recovery of sheet metal after the stamping process. The automobile industry is gradually moving from use of conventional steels to advanced high strength steels (AHSS) for their light weight and greater strength properties; however AHSS possesses greater springback effect due to higher elastic limit which proves to be difficult to deal with the springback effect. Hence it is imperative that the counter measures are taken to minimize the springback effect. The purpose of the study is to showcase various factors that influence the prediction of springback phenomenon. In this study the simulation results are compared with scanned data of actual stamped panels and their deviation is studied. In addition to these the virtual simulations are performed with changes in parameters such as material model, mesh parameters, adaptive level, and surface smooth contact to cut down the deviation that was observed earlier between the simulation results and actual panel. This is to find the best process and standardize to achieve simulation results closer to real data. The study enabled us to choose a combination from the above mentioned parameters to achieve better springback results correlating to the actual stamped panel.
- Sarin Babu Thokala - Chrysler India Automotive Pvt Ltd
- Sathya Narayanan - Chrysler India Automotive Pvt Ltd
- Naveed Ahamed - Chrysler India Automotive Pvt Ltd
- Deepak Ranjan Bhuyan - Chrysler India Automotive Pvt Ltd
- Praveen Balaj Balakrishnan - Chrysler India Automotive Pvt Ltd
- Sathya Dev - Chrysler Group LLC
CitationThokala, S., Narayanan, S., Ahamed, N., Bhuyan, D. et al., "Correlation Study on Parameters Affecting Springback Phenomenon in Stamping Simulation," SAE Technical Paper 2013-01-1169, 2013, https://doi.org/10.4271/2013-01-1169.
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