How the University of Michigan-Dearborn Prepares Engineering Graduates for Careers in Automotive Systems Engineering

2010-01-2327

10/19/2010

Event
SAE Convergence 2010
Authors Abstract
Content
The automotive industry is expected to accelerate the transition to revolutionary products, rapid changes in technology and increasing technological sophistication. This will require engineers to advance their knowledge, connect and integrate different areas of knowledge and be skilled in synthesis. In addition, they must learn to work in cross-disciplinary teams and adopt a systems approach. The College of Engineering and Computer Science (CECS) at the University of Michigan-Dearborn (UM-Dearborn) responded by creating interdisciplinary MS and Ph.D. programs in automotive systems engineering (ASE) and augmenting them with hands-on research. Students at the undergraduate level can also engage in numerous ASE activities. UM-Dearborn's ASE programs offer interesting and possibly unique advantages. The first is that it offers a spectrum of ASE degree and credit programs, from the MS to the Ph.D. to continuing education. Second, UM-Dearborn's ASE classroom activities are augmented by both basic and practice-oriented research. Third, UM-Dearborn is located in one of the world's largest concentrations of automotive engineers, providing a wealth of partnership opportunities and encouraging CECS faculty to engage in practical collaborative automotive research. This research carries into the classrooms to make the ASE curriculum practical and relevant. Many MS-ASE and PhD-ASE students go to school part-time while working full-time at a local automotive OEM or supplier company. They share their professional experiences in class and bring a sense of realism, practicality and relevance to the ASE program.
Meta TagsDetails
DOI
https://doi.org/10.4271/2010-01-2327
Pages
12
Citation
Shulze, R., and Mallick, P., "How the University of Michigan-Dearborn Prepares Engineering Graduates for Careers in Automotive Systems Engineering," SAE Technical Paper 2010-01-2327, 2010, https://doi.org/10.4271/2010-01-2327.
Additional Details
Publisher
Published
Oct 19, 2010
Product Code
2010-01-2327
Content Type
Technical Paper
Language
English