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Experimental Study of an Electronic Module Potting Dispensing Process
Technical Paper
2008-01-0716
ISSN: 0148-7191, e-ISSN: 2688-3627
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English
Abstract
Often electrical components are encapsulated in a plastic material after assembly. The goal of this study is to determine what variables are most important in reducing potting variation and identify the key machine parameters which can be used to make adjustments to the potting process. To maximize the efficiency of testing, an L18 orthogonal array was used to structure an experiment. Hose temperature, orifice size, and pressure were found to be the most significant control factors studied in this experiment. Shifting from the initial settings for these factors to the recommended settings should increase the S/N of the potting process by 14.53db. Motor speed was found to be the most significant variable for adjusting the mean of the process. The noise factors induced in this study were found to be a significant source of variation. Filters can shift the mean potting material applied by 25% over their planned usage life. Moreover, new filters induce more variation than old filters.
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Citation
Vinarcik, E., "Experimental Study of an Electronic Module Potting Dispensing Process," SAE Technical Paper 2008-01-0716, 2008, https://doi.org/10.4271/2008-01-0716.Also In
Reliability and Robust Design in Automotive Engineering, 2008
Number: SP-2170; Published: 2008-04-14
Number: SP-2170; Published: 2008-04-14
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