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Study of Stress Measurements Technique for Internal Electrical Connection of Printed Circuit Boards using Synchrotron Radiation

Journal Article
2008-01-0697
ISSN: 1946-3979, e-ISSN: 1946-3987
DOI: https://doi.org/10.4271/2008-01-0697
Published April 14, 2008 by SAE International in United States
Study of Stress Measurements Technique for Internal Electrical Connection of Printed Circuit Boards using Synchrotron Radiation
Sector:
Citation: Ito, T., Asai, H., Miyakawa, S., Akiniwa, Y. et al., "Study of Stress Measurements Technique for Internal Electrical Connection of Printed Circuit Boards using Synchrotron Radiation," SAE Int. J. Mater. Manf. 1(1):291-298, 2009, https://doi.org/10.4271/2008-01-0697.
Language: English

References

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