Lead-time Reduction in Stamping CAE and Die Face Development using Massively Parallel Processing in Forming Simulations

2007-01-1678

4/16/2007

Authors
Abstract
Content
Since 1997, General Motors Body Manufacturing Engineering - Die Engineering Services (BME-DES) has been working jointly with our software vendor to develop and implement a parallel version of stamping simulation software for mass production analysis applications. The evolution of this technology and the insight gained through the implementation of DMP/MPP technology as well as performance benchmarks are discussed in this publication.
Meta TagsDetails
DOI
https://doi.org/10.4271/2007-01-1678
Citation
Gress, J., Xu, S., Joshi, R., Wang, C., et al., "Lead-time Reduction in Stamping CAE and Die Face Development using Massively Parallel Processing in Forming Simulations," SAE World Congress & Exhibition, Detroit, Michigan, United States, April 16, 2007, https://doi.org/10.4271/2007-01-1678.
Additional Details
Publisher
Published
4/16/2007
Product Code
2007-01-1678
Content Type
Technical Paper
Language
English