Thermal Design and Model Correlation of a Microgravity Vibration Isolation System for an International Space Station Facility

2006-01-2165

07/17/2006

Event
International Conference On Environmental Systems
Authors Abstract
Content
This paper describes the thermal design, analysis and test of a Microgravity Vibration Isolation System (MVIS) that will ensure the active isolation of the European Space Agency’s Fluid Science Laboratory (FSL) payload from vibration induced by the International Space Station (ISS) structure. The FSL is equipped with optical and electronic devices that are very sensitive to vibration, thermal distortion, temperature change and Electro Magnetic Interference (EMI). The MVIS has to provide a vibration attenuation of −40dB within the range of 0.1–100Hz without inducing thermal or electromagnetic interferences.
The sensitive FSL instruments are mounted in a floating structure called the Facility Core Element (FCE), whereas the rest of the FSL electronics, mechanics and cooling systems are fixed to the International Standard Payload Rack (ISPR). In order to minimize the FCE accelerations, the MVIS is composed of accelerometers, position sensors and magnets (attached to the FCE) that interact with coils controlled by the EU mounted on the ISPR.
The paper summarises the MVIS thermal design with respect to the FSL and MVIS performance and safety/durability requirements. It will also presents the MVIS thermal balance test results as well as the approach used to correlate the thermal model. Furthermore, the paper will describe the method used to calibrate the EU airflow of the FSL avionic air loop during the system integration and test campaign.
Meta TagsDetails
DOI
https://doi.org/10.4271/2006-01-2165
Pages
10
Citation
Lapensée, S., and Nikanpour, D., "Thermal Design and Model Correlation of a Microgravity Vibration Isolation System for an International Space Station Facility," SAE Technical Paper 2006-01-2165, 2006, https://doi.org/10.4271/2006-01-2165.
Additional Details
Publisher
Published
Jul 17, 2006
Product Code
2006-01-2165
Content Type
Technical Paper
Language
English