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Virtual Validation of Electronic System Packaging Using Reliability Criterion of an Electronic Component at its Solder Joint
Technical Paper
2006-01-1613
ISSN: 0148-7191, e-ISSN: 2688-3627
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English
Abstract
Electronic control modules for automotive applications are required to sustain harsh vibration conditions. With minimum mounting points and limit in size, the mechanical structure for the modules must provide sufficient rigidity and stiffness to support printed circuit board (PCB) and other electronic components. Physical testing of an electronic module can only be performed after the full assembly when all design and manufacturing are finalized. If the structure does not meet vibration requirement, the whole design process must be reiterated. To optimize design with reduced time and effort, computer modeling is used to conduct vibration analysis in which modes, PCB bending, structure stresses and area of improvement can be identified. Further more, electronic components are mounted on the system level model to study stresses at the component level such as solder joints. The computer model allows us to study the best location for a specific component and effect of its boundary conditions. This paper presents a methodology for virtual validation of electronic control systems using reliability criterion of an electronic component at its solder joint. Ball grid array package is used as example to demonstrate the procedure.
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Citation
Li, R. and Kang, A., "Virtual Validation of Electronic System Packaging Using Reliability Criterion of an Electronic Component at its Solder Joint," SAE Technical Paper 2006-01-1613, 2006, https://doi.org/10.4271/2006-01-1613.Also In
Reliability and Robust Design in Automotive Engineering, 2006
Number: SP-2032; Published: 2006-04-03
Number: SP-2032; Published: 2006-04-03
References
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- Mawer Andrew Lindsay Wayne “Reliability Comparison of PBGA and PQFP from Customer Application Reliability Test Motorola Internal Publication June 2002
- Li Ron “A Methodology for Fatigue Prediction of Electronic Components Under Random Vibration Load,” 394 400 Trans. of the ASME, J. of Electronic Packaging 123 Dec. 2001
- Levis K.-M. Mawer Andrew “Assembly and Solder Joint Reliability of Plastic Ball Grid Array with Lead Free Versus Lead-Tin Interconnect,” Proceedings of 50 th ECTC Conf. Las Vegas, Nevada may 2000
- Bowers Trevor S. Evans John L. Bozack Michael J. “ Reliability of Comparison of Leaded Array and Leadless Packages on Alternative PWB Finishes,” 189 202 2003 SMTA International Conf. Chicago, Illinois Sept. 23-25 2003