This content is not included in
your SAE MOBILUS subscription, or you are not logged in.
Super Slim Automotive Acceleration Sensor Fabrication Process Developed by Applying Surface MEMS Technology
Technical Paper
2006-01-1464
ISSN: 0148-7191, e-ISSN: 2688-3627
Annotation ability available
Sector:
Language:
English
Abstract
We have developed a novel capacitive acceleration sensor fabrication process by applying surface MEMS (Micro Electro-Mechanical System) technology and successfully introduced this process for volume production of a new super slim sensor. The new process uses the ICP-RIE(Inductively Coupled Plasma - Reactive Ion Etching) technology to etch single crystal SOI(Si on Insulator wafers. In this technology, vertical Si etching is followed by, lateral etching along the buried oxide to release the movable electrode. Because of a dry process, the new process does not cause the movable structures to stick to each other. Our process uses only three masks and reduces the sensor chip size to a half that of our conventional capacitive acceleration sensors.
Recommended Content
Technical Paper | Application of Integrated Sensor Module for Active Roll Control Systems |
Technical Paper | Incline and Acceleration Sensor |
Technical Paper | Intel One Time Programmable Memories - The Automotive Firmware Solution of the 80's |
Authors
Topic
Citation
Sugiura, K., Muto, H., Fukada, T., Fujino, S. et al., "Super Slim Automotive Acceleration Sensor Fabrication Process Developed by Applying Surface MEMS Technology," SAE Technical Paper 2006-01-1464, 2006, https://doi.org/10.4271/2006-01-1464.Also In
References
- Offenberg M. et al. Transducers 585 1995
- Core T. A. et al. Solid State Tech. 39 1993
- Ristic Lj. et al. “A Capacitive-type Accelerometer with Self-test F e a t u r e based on A Double-pinned Polysilicon Structure” Sensor and Actuators C13 1993 809
- Isobe Y. et al. “ultra-slim automotive accelerometer sensor Applied MEMS technology” 2005 S.A.E. International Congress and Exposition Detroit 2005