The Development of High-Accuracy Warpage Analysis CAE for Large, Thin Plastic Parts

2005-01-1070

04/11/2005

Event
SAE 2005 World Congress & Exhibition
Authors Abstract
Content
This paper presents an improved CAE method for high-accuracy warpage analysis. The physical properties of the materials that affect warpage are examined, considering the mechanisms at work in each of the three steps of the injection molding process: injection, pressure holding, and cooling/ejection. When a theoretical mechanism is not fully understood and measurements are inaccurate, correction is made based on the measurement values of large, thin parts. This paper describes both the analysis and application from more than two years of study using the new CAE method.
Meta TagsDetails
DOI
https://doi.org/10.4271/2005-01-1070
Pages
8
Citation
Takahara, T., Yoshinaga, M., Mizuno, T., Furuhashi, H. et al., "The Development of High-Accuracy Warpage Analysis CAE for Large, Thin Plastic Parts," SAE Technical Paper 2005-01-1070, 2005, https://doi.org/10.4271/2005-01-1070.
Additional Details
Publisher
Published
Apr 11, 2005
Product Code
2005-01-1070
Content Type
Technical Paper
Language
English