The Application of 3-D Electronic Speckle Pattern Interferometry in Assembly Process of Bolted Joints

2005-01-0896

04/11/2005

Authors
Abstract
Content
In this paper, an optical method for inspecting the bolt tension is presented. This method uses 3-D Electronic Speckle Pattern Interferometry (ESPI) technique to measure and monitor the deformation field on the surface of the clamped member, and to establish a reliable correlation with the bolt tension. A new torque-deformation tension control concept is presented on the basis of this deformation - bolt tension relationship. Because the relationship between the bolt tension and deformation is independent of the frictional variables of the bolt, the inspection and control accuracy by this optical method is more reliable than relying on the torque-tension relationship. This experimental study is completed on a bolted joint. The relationship between the in-plane deformation on a clamped pin and the bolt tension is established. The method for eliminating the effect of the rotation on the deformation measurement is provided. Repeatability experiment shows that tension scatter from deformation-tension signature established in this paper is much smaller than that relying on torque-tension signature.
Meta TagsDetails
DOI
https://doi.org/10.4271/2005-01-0896
Pages
7
Citation
Nassar, S., Meng, A., and Yang, L., "The Application of 3-D Electronic Speckle Pattern Interferometry in Assembly Process of Bolted Joints," SAE Technical Paper 2005-01-0896, 2005, https://doi.org/10.4271/2005-01-0896.
Additional Details
Publisher
Published
Apr 11, 2005
Product Code
2005-01-0896
Content Type
Technical Paper
Language
English