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S/MA Resin Recovery System and Recycling in OEM Specification Foam / Covered Instrument Panels
Technical Paper
2004-01-1750
ISSN: 0148-7191, e-ISSN: 2688-3627
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Language:
English
Abstract
Several million pounds of S/MA glass reinforced resin has been successfully recovered from manufacturing offal and reject foamed / covered Instrument Panels (IP's) over the past ten years. ACI-WIPAG and Visteon recovered high quality S/MA resin, prepared blends with virgin resin and injection-molded IP substrates meeting OEM specifications. This “S/MA Resin Reclaim” process has been an economical and environmental success; minimized landfill volume, reduced landfill disposal costs, recovered a valuable resource, increased material utilization and reduced raw material costs.
This paper reports on a new system and process to recover S/MA glass reinforced resin from manufacturing trim offal and reject IP's, blending and supplying OEM specification resin blends for molding instrument panel substrates. The system demonstrated economical recovery of an excellent quality “Reclaim” resin, blend consistency and uniformity for injection molding instrument panel substrates.
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Authors
Citation
Lieberman, M., Latture, M., Juneau-Stetkiw, P., Gallihugh, E. et al., "S/MA Resin Recovery System and Recycling in OEM Specification Foam / Covered Instrument Panels," SAE Technical Paper 2004-01-1750, 2004, https://doi.org/10.4271/2004-01-1750.Also In
References
- SAE Papers: 930035 , 960699 and 940655