This content is not included in
your SAE MOBILUS subscription, or you are not logged in.
Failure Mechanisms of Ball Grid Array Packages Under Vibration and Thermal Loading
Technical Paper
2004-01-1686
ISSN: 0148-7191, e-ISSN: 2688-3627
Annotation ability available
Sector:
Language:
English
Abstract
Automotive electronics face increasing reliability challenges in meeting thermal and vibration requirements. This paper addresses these challenging issues through an overview of automotive application environments; their corresponding accelerated life tests, and physics of failures. The accelerated load level is determined by industry-accepted formulations. Basis of accelerated life testing for both thermal and vibration is discussed. Dynamic difference in loading frequency and magnitude leads to different failure mechanisms. Under thermal and vibration loading conditions, fatigue domains and commonly observed failure modes of electronic components are further characterized in terms of low cycle and high cycle fatigue. Material behaviors under these loading conditions are also discussed with experimental and analytical results. In particular, failure mechanisms of ball grid array (BGA) packages are presented for thermal and vibration loading conditions. Observed failure mechanisms of solder balls are further correlated with analytical results from finite element modeling. Structural and loading parameters that impact BGA failure are analyzed to provide guidance on packaging and board layout.
Recommended Content
Authors
Citation
Li, R., "Failure Mechanisms of Ball Grid Array Packages Under Vibration and Thermal Loading," SAE Technical Paper 2004-01-1686, 2004, https://doi.org/10.4271/2004-01-1686.Also In
References
- Li Ron S. Poglitsch Larry “Fatigue of Plastic Ball Grid Array and Plastic Quad Flat Package under Automotive Vibration” 324 329 2001 SMTA International Conference Chicago, Illinois Sept. 30 – Oct.4, 2001
- Mawer Andrew Lindsay Wayne Reliability Comparison of PBGA and PQFP from Customer Application Reliability Test Motorola Internal Presentation June 2002
- Miner Milton A. “Cumulative Damage in Fatigue,” J.of Applied Mechanics Sept. 1954 A159 A164
- Qian Zhengfand Liu Sheng “On the Life Prediction and Accelerated Testing of Solder Joints” The International Journal of Microcircuits and Electronic Packaging 22 4 1999 288 304
- Xie D.J. Chan Yan C. Lai J.K.L. Hui I.K. “Fatigue Life Estimation of Surface Mount Solder Joints” IEEE Trans. on Components, Packaging, and Manufacturing Technology-Part B 19 3 Aug. 1996 669 678
- Li Ron S. “A Methodology for Fatigue Prediction of Electronic Components Under Random Vibration Load,” 394 400 Trans. of the ASME, J. of Electronic Packaging 123 Dec. 2001
- Li Ron S. “Finite Element Modeling of Ball Grid Array Packages in System Packaging Vibration Analysis” 89 94 2002 SMTA International Conference San Jose, California Dec. 3 – Dec.6, 2002
- Levis K.-M. Mawer A. “Assembly and Solder Joint Reliability of Plastic Ball Grid Array with Lead-Free Versus Lead-Tin Interconnect” Proceedings of 50th ECTC Conference Las Vegas, Nevada May 2000
- Bowers Trevor S. Evans John L. Bozack Michael J. “Reliability Comparison of Leaded Array & Leadless Packages on Alternative PWB Finishes” 189 202 2003 SMTA International Conference Chicago, Illinois Sept. 23 – 25 2003