Packaging for Next Generation Automotive Electronics

This paper describes the packaging impacts of forecast advances in automotive electronics in two significant areas:

• The need for a much higher processing performance than is currently found in automotive applications.
• The need for a much higher network performance within a vehicle.

In particular, the thermal and EMC issues resulting from these advances are discussed, and practical, cost effective, automotive relevant, solutions are proposed. To illustrate these issues in a realistic situation, a prototype implementation of a network vehicle controller has been developed.