A New Heat Carrier for Thermal Management of Spacecrafts

2003-01-2474

07/07/2003

Event
International Conference On Environmental Systems
Authors Abstract
Content
A new heat carrier for thermal management of spacecrafts, nanofluid, was prepared by suspending nanoscaled copper particles in the conventional process fluid. The transient hot-wire method and NXE-1 viscometer were respectively used to measure the thermal conductivity and the apparent viscosity of the nanofluids. The effects of the volume fraction of nanoparticles and the temperature on the transport properties were discussed. The experimental results reveal that the nanoparticles remarkably increase thermal conductivity of the fluid and the nanofluids has remarkably higher thermal conductivity than that of the conventional pure fluid. It shows that such nanofluid has great potential for thermal management and thermal control in the field of aerospace technology.
Meta TagsDetails
DOI
https://doi.org/10.4271/2003-01-2474
Pages
6
Citation
Yimin, X., and Qiang, L., "A New Heat Carrier for Thermal Management of Spacecrafts," SAE Technical Paper 2003-01-2474, 2003, https://doi.org/10.4271/2003-01-2474.
Additional Details
Publisher
Published
Jul 7, 2003
Product Code
2003-01-2474
Content Type
Technical Paper
Language
English