This content is not included in
your SAE MOBILUS subscription, or you are not logged in.
A Study on Creep Analysis of Automobile Instrumental Panel
Technical Paper
2003-01-1173
ISSN: 0148-7191, e-ISSN: 2688-3627
Annotation ability available
Sector:
Language:
English
Abstract
The operating temperature of IP (Instrument panel) of passenger vehicles usually ranges from under freezing temperature to over glass transition temperature. The varying temperature induces thermal expansion of IP. Coupled with constraint condition, thermal expansion causes thermal deformation, which sometimes turns into unwanted permanent deformation. In this study, non-linear finite element method has been introduced to study the deformation behavior of IP in thermal cycle test. The time-dependent deformation behavior of IP has been investigated using creep material model. To quantify the creep behavior of polymer material which has been applied to IP, flexural creep test has been performed on various stress, temperature condition. The test result has been fitted into a time-hardening type creep constitutive equation. The coefficient of creep equation has been validated with the comparison of test result and FEM simulation result. In view of short-term thermal loading case, such as thermal cycle test, the effect of creep has been studied by comparison with results of elastic plastic analysis and thermal cycle test result. With this study, the quality degradation of IP with operating time can be predicted
Recommended Content
Authors
- Tae-Jung Yeo - Applied Technology Research Dept., Hyundai MOBIS
- Soo Sang Kim - Applied Technology Research Dept., Hyundai MOBIS
- Soon Jo Park - Applied Technology Research Dept., Hyundai MOBIS
- Chul Soo Kim - Applied Technology Research Dept., Hyundai MOBIS
- Yune-Seo Park - Polymer Processing Technology Team, LG Chem. Ltd.
- Shi-Ho Lee - Polymer Processing Technology Team, LG Chem. Ltd.
Topic
Citation
Yeo, T., Kim, S., Park, S., Kim, C. et al., "A Study on Creep Analysis of Automobile Instrumental Panel," SAE Technical Paper 2003-01-1173, 2003, https://doi.org/10.4271/2003-01-1173.Also In
References
- Crawford R.J. Plastics Engineering 2nd Pergamon Press 1989
- Boyle J.T. Spence J. Stress Analysis for Creep Butterworth 1983
- ABAQUS user's manual 6.2