Thermoformed Soft Instrument Panel

2003-01-1171

03/03/2003

Event
SAE 2003 World Congress & Exhibition
Authors Abstract
Content
The automotive industry is continually striving for opportunities to take additional cost and mass out of vehicle systems. Large parts such as an Instrument Panel retainer are good candidates because a small percent reduction in mass can translate into a significant material mass savings. Multiple requirements for a soft instrument panel including safety, stiffness, adhesion, etc. can make these savings difficult to achieve.
This paper will describe how a new material and process development for the fabrication of a soft instrument panel can produce 50% weight savings with a 20% cost reduction potential. In addition, this new technology exhibits improved performance over existing materials during safety testing.
Meta TagsDetails
DOI
https://doi.org/10.4271/2003-01-1171
Pages
6
Citation
Woodman, D., "Thermoformed Soft Instrument Panel," SAE Technical Paper 2003-01-1171, 2003, https://doi.org/10.4271/2003-01-1171.
Additional Details
Publisher
Published
Mar 3, 2003
Product Code
2003-01-1171
Content Type
Technical Paper
Language
English