Evaluation of SoftMountSM Technology for Use in Packaging UltraThinwall Ceramic Substrates

2002-01-1097

03/04/2002

Event
SAE 2002 World Congress & Exhibition
Authors Abstract
Content
Quantitative in-use pressure measurements were taken from packaging ceramic substrates with the SoftMountSM technology and two more traditional technologies, stuffing and tourniquet. Each technology was assessed using four separate mat materials. Mat selection enhanced the application of the SoftMountSM technology through the reduced pressures applied to the substrate during packaging. High temperature and low temperature thermal cycling studies were performed on the canned converters for the three packaging technologies so that an evaluation could be made of converter durability. The SoftMountSM packaging technology yielded the lowest pressures of all the processes studied, regardless of mat type. The laminar hybrid mat evaluated yielded the best combination of pressure and durability performance. Low temperature residual shear strengths following thermal cycling of the converters showed good correlation between the SoftMountSM technology and the stuffing method. All three packaging methods, SoftMountSM, stuffing, and tourniquet, yielded comparable high temperature residual shear strengths following thermal cycling.
Meta TagsDetails
DOI
https://doi.org/10.4271/2002-01-1097
Pages
11
Citation
Eisenstock, G., Locker, R., Sawyer, C., and Washington, K., "Evaluation of SoftMountSM Technology for Use in Packaging UltraThinwall Ceramic Substrates," SAE Technical Paper 2002-01-1097, 2002, https://doi.org/10.4271/2002-01-1097.
Additional Details
Publisher
Published
Mar 4, 2002
Product Code
2002-01-1097
Content Type
Technical Paper
Language
English