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Reliability Risks with Lead-Free Soldering and Possible Solutions
Technical Paper
2002-01-1048
ISSN: 0148-7191, e-ISSN: 2688-3627
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English
Abstract
The Japanese bans on solders containing Lead in mobile telecommunication products have caused the other telecommunication industries to go for Lead-Free solutions. The Lead-Free solder used by most telecommunication industries is SnAgCu-solder (95,8Sn3,5 Ag0,7Cu). This solder have a melting point of about 217 °C. This indicate the reflow temperature will increase by 30-40 °C, compared to the reflow temperature of the to day most used solder. (63Sn37PB with melting point 183 °C)
The increased solder reflow temperature will cause more intermetallics between Sn in the solder and Cu on the PCBs for example. This will have a negative effect on the long term reliability, especially for harsh applications as Power Train Electronics.
The increased reflow temperature will also increase the Pop Corn problem of IC-plastic packages, especially packages used in harsh environments. This can have a very negative effect on the long term reliability for system working in harsh environments.
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Citation
Danielsson, H., "Reliability Risks with Lead-Free Soldering and Possible Solutions," SAE Technical Paper 2002-01-1048, 2002, https://doi.org/10.4271/2002-01-1048.Also In
SAE 2002 Transactions Journal of Passenger Cars - Electronic and Electrical Systems
Number: V111-7; Published: 2003-09-15
Number: V111-7; Published: 2003-09-15
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