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Mechanical Behaviour of Sn-Pb and Sn-Ag Soldering Alloys for Printed Circuit Boards of the Automotive Industry
Technical Paper
2001-01-3220
ISSN: 0148-7191, e-ISSN: 2688-3627
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English
Abstract
In the present work, a comparative study of the constitutive equations describing the flow behaviour at relatively high homologous temperatures of eutectic tin-lead and tin-silver alloys is carried out. For this purpose uniaxial compression tests were performed on the latter two alloys at diverse strain rates and temperatures. Results showed that at relatively low temperatures the deformation response can be considered to be controlled by the same mechanism. However, the tin-lead eutectic, displayed superplastic behaviour at high temperatures.
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Authors
- J. M. Cabrera - Departamento de Ciencia de los Materiales e Ingeniería Metalúrgica Centre Tecnològic de Manresa Universitat Politécnica de Catalunya
- J. M. Prado - Departamento de Ciencia de los Materiales e Ingeniería Metalúrgica Centre Tecnològic de Manresa Universitat Politécnica de Catalunya
- A. Subirats - Lear Automotive, European Technological Center
- J. A. Cubero - Lear Automotive, European Technological Center
Citation
Cabrera, J., Prado, J., Subirats, A., and Cubero, J., "Mechanical Behaviour of Sn-Pb and Sn-Ag Soldering Alloys for Printed Circuit Boards of the Automotive Industry," SAE Technical Paper 2001-01-3220, 2001, https://doi.org/10.4271/2001-01-3220.Also In
References
- Glazer J. International Materials Review 1995 40 2 65 93
- Sellars C.M. Tegart W.J.McG. Mémoires Scientifiques de la Revue de Métallurgie 1966 LXIII 9 731 746
- Garofalo F. Transactions of the Metallurgical Society of AIME 1963 227 351 356
- Jonas J.J. Sellars C.M. Tegart W.J.McG. Metallurgical Reviews 1969 14 1 23
- Barrett C.R. Ardell A.J. Sherby O.D. Transactions of the Metallurgical Society of AIME Feb. 1964 230 200 204
- Lund R.W. Nix W.D. Metallurgical Transactions July 1975 6A 1329 1333
- Malu M. Tien J.K. Scripta Metallurgica 1975 9 1117 1120
- Frost H.J. Ashby M.F. “Deformation-Mechanism Maps” 1982 Oxford Ed. Pergamon Press
- Darveaux R. Banerji K. IEEE Transactions on Components, Hybrids, and Manufacturing Technology 1992 15 6 1013
- Yang W. Felton L.E. Messler R.W. Journal of Electronic Materials 1995 24 10 1465
- Murry K.L. Yang H. Deane P. Magill P. Proceedings of Interpack'97: Advances in Electronic Packaging 1997 19 1 1221
- Mathew M.D. Movva S. Yang H. Murry K.L. Proceedings of Creep behaviour of Advanced Materials for the 21 st century TMS 199 51 60
- Grivas D. Murty K.L. Morris J.W. Acta Metallurgica 1979 27 731 737
- Kashyap B.P. Murty G.S. Materials Science and Engineering 1981 50 205 213
- Murty K.L. Mohamed F.A. Dorn J.E. Acta Metallurgica 1972 20 1009 1018
- Tomlinson W.L. Fullylove A. Journal of Materials Science 1992 27 5777 5782
- McCabe R.J. Fine M.E. Journal of Materials 2000 June 33 35