Environment-Friendly Fluxless Soldering Process for High Sealing Ability on Pressure Sensors
2001-01-0341
03/05/2001
- Event
- Content
- In a conventional soldering process, solvents, such as chlorofluorocarbons (CFCs), have been necessary to remove the flux-residue after soldering.A new CFC-free fluxless soldering process has been developed to obtain high sealing ability even in a small soldering area. This new process utilizes a reducing atmosphere with an appropriate load and assembly orientation to solder the parts. Under this fluxless condition, it is found that appropriate loading and good solder-wettability of the upper part increase the wettability of the lower part.
- Pages
- 7
- Citation
- Yoneyama, T., Okada, H., Izuchi, K., and Kojima, F., "Environment-Friendly Fluxless Soldering Process for High Sealing Ability on Pressure Sensors," SAE Technical Paper 2001-01-0341, 2001, https://doi.org/10.4271/2001-01-0341.