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Thin Film Pressure Sensor Technology Applied to Catalytic Converter Packaging
Technical Paper
2001-01-0223
ISSN: 0148-7191, e-ISSN: 2688-3627
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Event:
SAE 2001 World Congress
Language:
English
Abstract
Application of new ultra-thinwall ceramic substrate technology to many new vehicle exhaust emission applications has lead to an interest in better understanding the pressures to which substrates are exposed during packaging operations. A recently identified thin film load cell technology has permitted a more analytical evaluation of pressure distributions that develop during ceramic substrate packaging. The optimum configuration of this technique for studying canning operations will be investigated as part of the study. In addition to identifying the characteristic pressure distributions created during canning processes, the impact of various process parameters on this distribution was also investigated.
Authors
Citation
Locker, R., Sawyer, C., and Eisenstock, G., "Thin Film Pressure Sensor Technology Applied to Catalytic Converter Packaging," SAE Technical Paper 2001-01-0223, 2001, https://doi.org/10.4271/2001-01-0223.Data Sets - Support Documents
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References
- Myers, S.J. Wooten, J.E. Turek, A.G. Boehnke J. “Force Distribution on Catalysts During Converter Assembly” SAE #2000-10-0222 March 6 2000
- I-Scan For Windows Pressure Measurement system, User's Manual Tekscan Boston, MA July 1998
- Gulati S.T. Reddy K.P “Measurements of Biaxial Compressive Strength of Cordierite Ceramic Honeycombs,” SAE # 930165 93 Int'l Congress and Exposition Detroit, MI March 1993
- Kummer H.W. “Unified Theory of Rubber and Tire Friction,” Eng. Research Bulletin Pennsilvania State University July 1966