Thermal Management of Microelectronics by Axial Jet Impingement

1999-01-2480

08/02/1999

Event
34th Intersociety Energy Conversion Engineering Conference
Authors Abstract
Content
A free jet of high Prandtl number fluid impinging perpendicularly on a solid substrate of finite thickness containing small discrete heat sources on the opposite surface has been analyzed. Both solid and fluid regions have been modeled and solved as a conjugate problem. Computed results included the velocity, temperature, and pressure distributions in the fluid, and the local and average heat transfer coefficients at the solid-fluid interface. Numerical results were validated with available experimental data. It was found that the thickness of the disk as well as the location of the discrete sources showed strong influence on the maximum temperature and the average heat transfer coefficient.
Meta TagsDetails
DOI
https://doi.org/10.4271/1999-01-2480
Pages
11
Citation
Bula, A., Rahman, M., and Leland, J., "Thermal Management of Microelectronics by Axial Jet Impingement," SAE Technical Paper 1999-01-2480, 1999, https://doi.org/10.4271/1999-01-2480.
Additional Details
Publisher
Published
Aug 2, 1999
Product Code
1999-01-2480
Content Type
Technical Paper
Language
English