Verification of a Transient Loop Heat Pipe Model

1999-01-2010

07/12/1999

Event
International Conference On Environmental Systems
Authors Abstract
Content
Loop Heat Pipes (LHPs) have been base-lined for thermal management in the next generation of large communication satellites due to their ability to effectively transport energy using two-phase heat transfer. To incorporate LHPs in thermal design, a subroutine was developed to work with a nodal thermal analyzer for transient predictions of LHP operating temperatures. The thermal analyzer (e.g., SINDA or IDEAS/TMG) is used to advance the thermal solution in time, while the subroutine provides the time-varying fluid boundary conditions and adjusts thermal couplings by solving the conservation equations of mass, momentum and energy.
The subroutine was exercised in conjunction with a nodal thermal analyzer to predict the fluid temperatures in a loop heat pipe during transient changes in power and sink temperature. A laboratory test was performed with an ammonia LHP to collect data for verifying the model. Presented in this paper is a description of the model and the test data used to examine the model’s prediction capability.
Meta TagsDetails
DOI
https://doi.org/10.4271/1999-01-2010
Pages
12
Citation
Wrenn, K., Krein, S., Hoang, T., and Allen, R., "Verification of a Transient Loop Heat Pipe Model," SAE Technical Paper 1999-01-2010, 1999, https://doi.org/10.4271/1999-01-2010.
Additional Details
Publisher
Published
Jul 12, 1999
Product Code
1999-01-2010
Content Type
Technical Paper
Language
English