The Evolution of Microchannel Heat Transfer

High-density electronics packaging requires new advancement in thermal management. New efforts to standardize three-dimensional electronics packages provide the opportunity to standardize thermal management systems for the first time. Microchannel cooling, a high heat flux technology, is the leading candidate for standardization of earth- and space- based electronics packages. This paper looks at the developments in microchannel cooling that make it more advantageous than other high heat flux techniques and the work that remains to achieve a standardized thermal management system.