The Heat Pump Thermal Bus - An Alternative to Pumped Coolant Loops

1999-01-1356

04/06/1999

Event
Aerospace Power Systems Conference
Authors Abstract
Content
This paper will describe a patent-pending approach of using a vapor compression system to also provide a forced two-phase indirect heat transfer loop. This system can be configured with water boiler peak cooling thermal control hardware to avoid the high ambient temperatures associated with supersonic low altitude flight. Due to the very short duration of this high ambient condition, water boiler transient cooling techniques have potential. The water boiler can also be used for ground based cooling when flight-line ground cooling carts are unavailable. The use of a PID controller to accurately control the cold plate temperatures when used with a solenoid activated by-pass circuit will be described.
Meta TagsDetails
DOI
https://doi.org/10.4271/1999-01-1356
Pages
9
Citation
Scaringe, R., and Grzyll, L., "The Heat Pump Thermal Bus - An Alternative to Pumped Coolant Loops," SAE Technical Paper 1999-01-1356, 1999, https://doi.org/10.4271/1999-01-1356.
Additional Details
Publisher
Published
Apr 6, 1999
Product Code
1999-01-1356
Content Type
Technical Paper
Language
English