Using SWaP-C Reductions to Improve UAS/UGV Mission Capabilities

The defense and aerospace market continues to push for reductions in size, weight, power, and cost (SWaP-C) to support advanced sensor/vetronics payloads onboard unmanned platforms. Ground-breaking SWaP-C reduction for processor and network switch systems are enabling UAS (unmanned aircraft system) and UGV (unmanned ground vehicle) platforms to expand their mission capabilities. Several technologies are driving this small form factor revolution, including tightly integrated system-on-chips (SoCs), semiconductor packaging advancements (i.e. smaller nanometer dies, lower voltage chips), and micro-miniature rugged connectors.

The need for ever greater SWaP reductions stems largely from the balance between the small size of many unmanned platforms and the amount of payload electronics that needs to be integrated on those platforms. For the most part UGVs, UUVs, USVs, UAVs are smaller platforms, and generally speaking their mission and purpose is to serve as a sensor host for information gathering. These sensors can include FLIR cameras and other types of imaging technology to conduct surveillance, and capture video or photos or mapping information.