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A Novel Cloud-Based Additive Manufacturing Technique for Semiconductor Chip Casings

Journal Article
05-15-04-0025
ISSN: 1946-3979, e-ISSN: 1946-3987
DOI: https://doi.org/10.4271/05-15-04-0025
Published August 02, 2022 by SAE International in United States
A Novel Cloud-Based Additive Manufacturing Technique for Semiconductor Chip Casings
Citation: Viswanath, S., Siddharth, S., and Subramanian, J., "A Novel Cloud-Based Additive Manufacturing Technique for Semiconductor Chip Casings," SAE Int. J. Mater. Manf. 15(4):395-406, 2022, https://doi.org/10.4271/05-15-04-0025.
Language: English

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