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Effects of Grinding Parameters on Surface Quality in High-Speed Grinding Considering Maximum Undeformed Chip Thickness

Journal Article
05-13-02-0010
ISSN: 1946-3979, e-ISSN: 1946-3987
DOI: https://doi.org/10.4271/05-13-02-0010
Published January 27, 2020 by SAE International in United States
Effects of Grinding Parameters on Surface Quality in High-Speed Grinding Considering Maximum Undeformed Chip Thickness
Sector:
Citation: Zhang, L., Kang, M., and Tang, W., "Effects of Grinding Parameters on Surface Quality in High-Speed Grinding Considering Maximum Undeformed Chip Thickness," SAE Int. J. Mater. Manf. 13(2):139-149, 2020, https://doi.org/10.4271/05-13-02-0010.
Language: English

References

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