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Measurement of Radiated Emissions From Integrated Circuits-Tem/Wideband Tem (Gtem) Cell Method; Tem Cell (150 Khz to 1 Ghz), Wideband Tem Cell (150 Khz to 8 Ghz)

Electromagnetic Radiation (EMR) Task Force
  • Ground Vehicle Standard
  • J1752/3_199503
  • Historical
Published 1995-03-01 by SAE International in United States
This measurement procedure defines a method for measuring the electromagnetic radiation from an integrated circuit (IC). The IC being evaluated is mounted on an IC test printed circuit board (PCB) that is clamped to a mating port (referred to as a wall port) cut in the top or bottom of a TEM or wideband TEM (GTEM) cell. The test board is not in the cell as in the conventional usage but becomes a part of the cell wall. This method is applicable to any TEM or GTEM cell modified to incorporate the wall port; however, the measured RF voltage is affected by the septum to test board (wall) spacing. This procedure was developed using a 1 GHz TEM cell with a septum to wall spacing of 45 mm and a GTEM cell with average septum to wall spacing of 45 mm over the port area. Other cells may not produce identical spectral output but may be used for comparative measurements, subject to their frequency and sensitivity limitations. A conversion factor may allow comparisons between data…

Measurement of Radiated Emissions From Integrated Circuits-Surface Scan Method (Loop Probe Method) 10 Mhz to 3 Ghz

Electromagnetic Radiation (EMR) Task Force
  • Ground Vehicle Standard
  • J1752/2_199503
  • Historical
Published 1995-03-01 by SAE International in United States
This SAE Recommended Practice defines a method for evaluating the near field electric or magnetic component of the electromagnetic field at the surface of an integrated circuit (IC). This technique is capable of providing a detailed pattern of the RF sources internal to the IC. The resolution of the pattern is determined by the characteristics of the probes used and the precision of the mechanical probe positioner. The method is usable over the 10 MHz to 3 GHz frequency range with existing probe technology. The probe is mechanically scanned according to a programmed pattern in a plane parallel or perpendicular to the IC surface and the data is computer processed to provide a color-enhanced representation of field strength at the scan frequency. This procedure is applicable to measurements from an IC mounted on any circuit board that is accessible to the scan probe. For comparisons, the standardized test board shall be used. This diagnostic procedure is intended for IC architectural analysis including functional floor plan and power distribution.