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Requirements for Plastic Encapsulated Microcircuits in Military and Avionics Applications

CE-12 Solid State Devices
  • Aerospace Standard
  • AS6294/2
  • Current
Published 2018-04-24 by SAE International in United States
This SAE Aerospace Standard (AS) documents and establishes common industry practices, and screening and qualification testing, of Plastic Encapsulated Microcircuits (PEMs) for use in military and avionics application environments.
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Requirements for Plastic Encapsulated Microcircuits in Space Applications

CE-12 Solid State Devices
  • Aerospace Standard
  • AS6294/1
  • Current
Published 2017-11-21 by SAE International in United States
This document establishes common industry practices and recommended screening, qualification, and lot acceptance testing of Plastic Encapsulated Microcircuits (PEMs) for use in space application environments.
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Long Term Storage of Electronic Devices

CE-12 Solid State Devices
  • Aerospace Standard
  • GEIASTD0003A
  • Current
Published 2017-01-04 by SAE International in United States
This document provides an industry standard for Long Term Storage (LTS) of electronic devices by drawing from the best long term storage practices currently known. LTS is defined as any device storage for more than 12 months but typically allows for much longer (years). While intended to address the storage of unpackaged semiconductors and packaged electronic devices, nothing in this standard precludes the storage of other items under the storage levels defined herein. This standard is not intended to address built-in failure mechanisms (e.g., tin whiskers, plating diffusion, and intermetallics) that would take place regardless of storage conditions
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Counterfeit Parts & Materials Risk Mitigation

CE-12 Solid State Devices
  • Aerospace Standard
  • TB0003A
  • Current
Published 2016-11-08 by SAE International in United States

This Technical Bulletin covers the following areas of concern.

Diminishing Manufacturing Sources and Material Shortages (DMSMS) Management Practices

CE-12 Solid State Devices
  • Aerospace Standard
  • GEB1
  • Current
Published 2015-07-01 by SAE International in United States

Diminishing Manufacturing Sources and Material Shortages (DMSMS) is the loss or impending loss of manufacturers or suppliers of critical items and raw materials due to production discontinuance. DMSMS is an increasingly difficult problem for DoD weapon systems because the manufacturing lives of many critical items get shorter while the life cycles of military weapon systems keep increasing. Traditionally, efforts to mitigate the effects of DMSMS have been reactive; that is, the effects are addressed only when they are seen. This reactive approach to DMSMS solutions leads to decisions that put a premium on faster solution paths with attractive short-term gains in order to avoid system inoperability, while ignoring the long-term solution paths that would lead to generic families of solutions or larger-scale solutions with the capability of avoiding future DMSMS issues. In order to solve DMSMS issues with lower overall cost, DMSMS solutions must change from reactive to proactive. The building blocks of effective proactive management of DMSMS are established during the design and development of systems. If systems are designed with the inevitability of DMSMS in mind, early solution paths with largescale solutions can be started at an appropriately early time to enable intelligent choices without the imminent threat of system inoperability. Such generic large-scale solutions and a consensus on where DMSMS threats are most prevalent can be better forecasted by the use of a standard set of DMSMS management practices used by the foremost members of industry. The creation, dissemination, and widespread use of such a standard can greatly help the cause of proactive management of DMSMS.

Reducing the Risk of Tin Whisker-Induced Failures in Electronic Equipment

CE-12 Solid State Devices
  • Aerospace Standard
  • GEIAGEB0002
  • Current
Published 2014-10-01 by SAE International in United States
This Bulletin provides a brief description of tin whisker formation and describes various methods recommended by government and industry to reduce the risk of tin whisker-induced failures in electronic hardware. It is not a mandate nor does it contain any requirements. A tin whisker is a single crystal that emerges from tin-finished surfaces. Tin whiskers can pose a serious reliability risk to electronic assemblies that have pure tin finish. The general risks fall into several categories: [1, 2, 3, 8, 16] Short Circuits: The whisker can create a short circuit, either by 1) growing from an area at one potential to an area at another or 2) breaking free and later bridging these areas. In some cases, these shorts may be permanent and cause catastrophic system failures. A transient short may result if the available current exceeds the fusing current of the whisker, and the whisker can fuse open. The amount of current needed to fuse open the whisker depends on the atmospheric pressure and the diameter of the whisker. Low-pressure-Induced Metal Vapor Arcing (Plasma):…
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Acceleration Factors

CE-12 Solid State Devices
  • Aerospace Standard
  • SSB1_003A
  • Current
Published 2014-09-12 by SAE International in United States
This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications (the latest revision). This document provides reference information concerning acceleration factors commonly used by device manufacturers to model failure rates in conjunction with statistical reliability monitoring. These acceleration factors are frequently used by OEMs in conjunction with physics of failure reliability analysis to assess the suitability of plastic encapsulated microcircuits and semiconductors for specific end use applications.
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Qualification and Reliability Monitors

CE-12 Solid State Devices
  • Aerospace Standard
  • SSB1_001
  • Current
Published 2014-09-12 by SAE International in United States
This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications (the latest revision). The scope of this document is to establish the recommended minimum qualification and monitoring testing of plastic encapsulated microcircuits and discrete semiconductors suitable for potential use in many rugged, military, severe, or other environments.
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Environmental Tests and Associated Failure Mechanisms

CE-12 Solid State Devices
  • Aerospace Standard
  • SSB1_002
  • Current
Published 2014-09-12 by SAE International in United States
This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications. This document provides reference information concerning the environmental stresses associated with tests specifically designed to apply to (or have unique implications for) plastic encapsulated microcircuits and semiconductors, and the specific failures induced by these environmental stresses.
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Derating of Electronic Components

CE-12 Solid State Devices
  • Aerospace Standard
  • GEIASTD0008
  • Current
Published 2011-08-01 by SAE International in United States
This Standard specifies the minimum derating requirements for using electronic components in moderately severe environments. These environments are assumed to include Airborne Inhabited Cargo (AIC), Airborne Inhabited Fighter (AIF), Ground Mobile (GM), and Naval Sheltered (NS) environments specified in MIL-HDBK-217. This Standard is intended to supersede the derating limits contained in Defense Standardization Program Office (DSPO) Standardization Directive SD-18, Naval Standard TE000-AB-GTP-010, and Air Force ESD-TR-85-148. It is intended that a future revision of this Standard will include additional requirements for derating for other environments (e.g. Airborne Uninhabited Cargo). Since this Standard specifies the minimum derating requirements, (sub)contractors may derate in excess of these requirements. This Standard is not intended for use in space or launch system applications, which have their own existing derating standards, and shall not be used for such applications unless specifically allowed by contract.
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