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Requirements for Plastic Encapsulated Microcircuits Discrete Semiconductors in Space Applications

CE-12 Solid State Devices
  • Aerospace Standard
  • AS6294/3
  • Current
Published 2019-08-07 by SAE International in United States

This document establishes the requirements for screening, qualification, and lot acceptance testing of Plastic Encapsulated Discrete Semiconductors (PEDS) for use in space application environments. The scope of this document is intended for standard silicon based technology only, but the process and methodology described within can be adopted for other technologies such as Silicon Carbide, Gallium Nitride, and Gallium Arsenide. However, when non-silicon based technology parts are being used, the device characterization shall be modified, and it is recommended to use available industry standards based upon published research/testing reports for those technology to address applicable physics of failure.

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Requirements for Plastic Encapsulated Discrete Semiconductors in Military and Avionics Applications

CE-12 Solid State Devices
  • Aerospace Standard
  • AS6294/4
  • Current
Published 2019-07-09 by SAE International in United States
This standard documents and establishes common industry practices, and screening and qualification testing, of plastic encapsulated discrete semiconductors (PEDs) for use in military and avionics application environments.
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Requirements for Plastic Encapsulated Microcircuits in Military and Avionics Applications

CE-12 Solid State Devices
  • Aerospace Standard
  • AS6294/2
  • Current
Published 2018-04-24 by SAE International in United States
This SAE Aerospace Standard (AS) documents and establishes common industry practices, and screening and qualification testing, of Plastic Encapsulated Microcircuits (PEMs) for use in military and avionics application environments.
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Requirements for Plastic Encapsulated Microcircuits in Space Applications

CE-12 Solid State Devices
  • Aerospace Standard
  • AS6294/1
  • Current
Published 2017-11-21 by SAE International in United States
This document establishes common industry practices and recommended screening, qualification, and lot acceptance testing of Plastic Encapsulated Microcircuits (PEMs) for use in space application environments.
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Long Term Storage of Electronic Devices

CE-12 Solid State Devices
  • Aerospace Standard
  • GEIASTD0003A
  • Current
Published 2017-01-04 by SAE International in United States
This document provides an industry standard for Long Term Storage (LTS) of electronic devices by drawing from the best long term storage practices currently known. LTS is defined as any device storage for more than 12 months but typically allows for much longer (years). While intended to address the storage of unpackaged semiconductors and packaged electronic devices, nothing in this standard precludes the storage of other items under the storage levels defined herein. This standard is not intended to address built-in failure mechanisms (e.g., tin whiskers, plating diffusion, and intermetallics) that would take place regardless of storage conditions
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Counterfeit Parts & Materials Risk Mitigation

CE-12 Solid State Devices
  • Aerospace Standard
  • TB0003A
  • Current
Published 2016-11-08 by SAE International in United States

This Technical Bulletin covers the following areas of concern.

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Diminishing Manufacturing Sources and Material Shortages (DMSMS) Management Practices

CE-12 Solid State Devices
  • Aerospace Standard
  • GEB1
  • Current
Published 2015-07-01 by SAE International in United States

Diminishing Manufacturing Sources and Material Shortages (DMSMS) is the loss or impending loss of manufacturers or suppliers of critical items and raw materials due to production discontinuance. DMSMS is an increasingly difficult problem for DoD weapon systems because the manufacturing lives of many critical items get shorter while the life cycles of military weapon systems keep increasing. Traditionally, efforts to mitigate the effects of DMSMS have been reactive; that is, the effects are addressed only when they are seen. This reactive approach to DMSMS solutions leads to decisions that put a premium on faster solution paths with attractive short-term gains in order to avoid system inoperability, while ignoring the long-term solution paths that would lead to generic families of solutions or larger-scale solutions with the capability of avoiding future DMSMS issues. In order to solve DMSMS issues with lower overall cost, DMSMS solutions must change from reactive to proactive. The building blocks of effective proactive management of DMSMS are established during the design and development of systems. If systems are designed with the inevitability of DMSMS in mind, early solution paths with largescale solutions can be started at an appropriately early time to enable intelligent choices without the imminent threat of system inoperability. Such generic large-scale solutions and a consensus on where DMSMS threats are most prevalent can be better forecasted by the use of a standard set of DMSMS management practices used by the foremost members of industry. The creation, dissemination, and widespread use of such a standard can greatly help the cause of proactive management of DMSMS.

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Reducing the Risk of Tin Whisker-Induced Failures in Electronic Equipment

CE-12 Solid State Devices
  • Aerospace Standard
  • GEIAGEB0002
  • Current
Published 2014-10-01 by SAE International in United States
This Bulletin provides a brief description of tin whisker formation and describes various methods recommended by government and industry to reduce the risk of tin whisker-induced failures in electronic hardware. It is not a mandate nor does it contain any requirements. A tin whisker is a single crystal that emerges from tin-finished surfaces. Tin whiskers can pose a serious reliability risk to electronic assemblies that have pure tin finish. The general risks fall into several categories: [1, 2, 3, 8, 16] Short Circuits: The whisker can create a short circuit, either by 1) growing from an area at one potential to an area at another or 2) breaking free and later bridging these areas. In some cases, these shorts may be permanent and cause catastrophic system failures. A transient short may result if the available current exceeds the fusing current of the whisker, and the whisker can fuse open. The amount of current needed to fuse open the whisker depends on the atmospheric pressure and the diameter of the whisker. Low-pressure-Induced Metal Vapor Arcing (Plasma):…
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Acceleration Factors

CE-12 Solid State Devices
  • Aerospace Standard
  • SSB1_003A
  • Current
Published 2014-09-12 by SAE International in United States
This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications (the latest revision). This document provides reference information concerning acceleration factors commonly used by device manufacturers to model failure rates in conjunction with statistical reliability monitoring. These acceleration factors are frequently used by OEMs in conjunction with physics of failure reliability analysis to assess the suitability of plastic encapsulated microcircuits and semiconductors for specific end use applications.
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Qualification and Reliability Monitors

CE-12 Solid State Devices
  • Aerospace Standard
  • SSB1_001
  • Current
Published 2014-09-12 by SAE International in United States
This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications (the latest revision). The scope of this document is to establish the recommended minimum qualification and monitoring testing of plastic encapsulated microcircuits and discrete semiconductors suitable for potential use in many rugged, military, severe, or other environments.
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